Camera Module Design Lead

Camera Module Design Lead

Do you love taking on big challenges that require exceptionally creative solutions? Do you deeply understand how an incredible camera experience should work? As part of our Camera Technologies group, you'll help design the innovative technology that allows each generation of Apple products to produce photos even more incredible than the last. You'll design and develop groundbreaking ideas for everything involved in our camera systems, from sensor to lens. You'll collaborate with teams across Apple to research, design, develop, test, and qualify camera hardware for Apple products. Together, we'll craft a magical photography experience that redefines what millions of customers can expect from their cameras. Bring passion and dedication to your job and there's no telling what you could accomplish! The Camera Hardware Engineering group is responsible for all research, design, development, test, and qualification of camera hardware for Apple products. We are searching for extraordinary Hardware Engineers to take ownership in the development and system integration of very high-performance, compact camera modules. We are seeking an engineer to take leadership of camera hardware projects in engagements with product and technology teams.

Minimum Qualifications

• BSc/MSc/PhD in relevant field (Electrical Engineering, Mechanical Engineering, Optics, Physics, Materials or equivalent).
• Able to communicate and convey ideas clearly and concisely.

Preferred Qualifications

• Ability to lead a multi-functional team of engineers and scientists with outstanding background and technical expertise through the R&D phase of product development from concept to mass production is a key requirement.
• Ability to influence other teams, manage risk, make decisions with limited amount of information, deliver against a fast-paced development schedule are key requirements.
• The applicant will also be familiar with at least 3 of the skills listed below:
• Design and tolerance analysis of highly constrained, high-volume actuators or translational mechanisms.
• Electronic circuit and system design including power and signal integrity.
• Understanding of geometric optics and image quality evaluation including test charts, algorithms, and lighting.
• Image/depth sensor design or characterization.
• Compact module manufacturing processes such as sensor attachment, flex attachment, active alignment, etc.
• Failure analysis techniques such as optical microscopy, X-ray, CT scans or SEM.
• Demonstrated ability in root-cause and corrective-action analysis.
• Proficiency in statistical analysis, data reporting, and visualization.
• Proven track record of successfully delivering new products into mass production on time, meeting yield and efficiency targets.