Mixed Signal Circuit Designer For Single Molecule Sensors (m/f/d)

Mixed Signal Circuit Designer

Nanogami is a highly innovative and rapidly growing startup in the field of DNA Origami-based nanotechnology. Our international team is driven by a shared vision: to pioneer a novel generation of biochips set to unlock applications in research and diagnostics and thereby pushing the boundaries of personalised medicine to new heights. In 2022 we secured significant funding by SPRIND - Germany's Federal Agency for Disruptive Innovation to realize our ambitious growth trajectory and now aim to significantly expand our current team to support the at-scale commercialisation of our nanotechnology.

To make this breakthrough technology a reality, we are seeking a mixed signal circuit designer (m/f/d) who will lead the development of our sensing architecture based, including a precision analog front-end and analog-to-digital conversion, signal processing, and communication. Your core responsibility will be overseeing and collaborating on the design and manufacturing of a chip that unlocks the full performance of our single molecule - sensing electrode design. To this end, you will translate data from experiments on our prototype into design and architecture decisions, working closely with CROs and foundries to realize a fully integrated chip ready for commercialisation. Your decisions and expertise will directly determine our platform's sensitivity, reliability, and manufacturability, making you instrumental in transforming how point-of-care diagnostics are delivered worldwide.

How you will contribute:

1. Lead the design and development of innovative, low-noise analog and mixed-signal ICs specifically for biosensing applications, including current digitization.
2. Architect and optimize critical circuits such as Transimpedance Amplifiers (TIAs), Analog-to-Digital Converter (ADC) interfaces, advanced filters, and precision biasing schemes.
3. Ensure robust circuit performance across process, voltage, and temperature (PVT) variations, delivering high accuracy and low power consumption.
4. Collaborate seamlessly with interdisciplinary teams including biologists, data scientists, and system architects to translate complex requirements into optimized IC specifications.
5. Drive the complete IC lifecycle: from comprehensive design documentation and advanced simulation to direct interaction with semiconductor fabs (e.g., TSMC, GF, XFAB) for GDSII submission and process management.
6. Oversee rigorous quality control, silicon bring-up, and characterisation, including report interpretation, wafer-level testing and yield analysis, to ensure flawless functionality and performance.